BSIA South Korea roadshow boosts Dhaka-Seoul semiconductor collaboration

The Bangladesh Semiconductor Industry Association (BSIA) has concluded a major engagement programme in South Korea as part of its global semiconductor roadshow, aiming to strengthen Bangladesh's ambitions of developing a future semiconductor ecosystem through international partnerships, talent development and advanced packaging initiatives.

The roadshow, which started on 11 May, featured a series of strategic meetings with leading Korean semiconductor stakeholders, including SK hynix and the Korea Semiconductor Industry Association (KSIA), reads a press release.

The programme began with a high-level strategic coordination meeting with the advanced team of SK hynix to discuss future collaboration opportunities involving semiconductor packaging, workforce development and broader ecosystem-building efforts.

Representatives from several BSIA member companies – including Dynamic Solution Innovators, PrimeSilicon, Siliconova, Ulkasemi and Neural Semiconductor Ltd – also held discussions with Korean semiconductor design house SuperGate.

The talks explored potential collaboration in semiconductor design services, embedded systems, AI-focused chip design, engineering support and verification technologies.

During a bilateral meeting with KSIA, the BSIA delegation discussed three major strategic initiatives.

These included exploring a collaborative "15-nation semiconductor alliance" aimed at strengthening global semiconductor resilience, talent mobility and long-term ecosystem cooperation.

The discussions also focused on expanding joint initiatives in semiconductor education, research, workforce training and academic collaboration between the two countries.

Both sides additionally explored long-term institutional cooperation between KSIA and BSIA to jointly promote the Korean and Bangladeshi semiconductor industries globally.

KSIA leaders reportedly welcomed Bangladesh's emerging semiconductor vision, highlighting the country's demographic advantages, growing engineering talent pool and ecosystem-building initiatives.

According to the discussions, Bangladesh has the potential to emerge as the world's 12th semiconductor hub through long-term policy support, capability development and international partnerships.

The day concluded with a banquet reception jointly organised by BSIA and the Embassy of Bangladesh in Seoul.

The event brought together industry leaders, researchers, policymakers and academic representatives from both Bangladesh and South Korea.

Among the speakers were BSIA President M A Jabbar and Bangladesh Ambassador to South Korea Toufiq Islam Shatil.

Muhammad Mustafa Hussain of Purdue University delivered a presentation titled "Vision of Bangladesh for Semiconductor Packaging," highlighting opportunities in advanced packaging, AI-driven semiconductor infrastructure and heterogeneous integration technologies.

BSIA member companies also showcased their technical expertise in semiconductor verification, testing, memory systems, AI hardware and engineering services.

The programme further featured a case-study presentation by Changhyun Kim, vice president and head of Packaging & Module at SK hynix, who discussed South Korea's semiconductor packaging success and the transition toward AI-era memory packaging technologies.

A separate insight session by McKinsey & Company focused on the future of advanced packaging ecosystems, particularly the growing importance of 2.5D and 3D packaging architectures and AI-centric semiconductor infrastructure.

BSIA said the South Korea roadshow is part of Bangladesh's broader "Silicon River" vision aimed at building a sustainable deep-tech ecosystem through talent development, policy support, infrastructure and international cooperation.

During the programme, BSIA also invited Korean industry leaders and ecosystem partners to participate in the BEAR Summit 2026, scheduled to be held in Dhaka on 25-26 July next year.